资格

• 应征条件

  {MUST}
  - Master's degree in semiconductors engineer if Fresher candidate.
  - Bachelor's degree in electronics, electric and telecomunication engineer and having 1-2 years as R&D Engineer for Semiconductor package product or assembly process for System in Package (SiP)
  - English skill: At least Intermediate level
  - Intermediate or higher level of utilization ability for Microsoft Outlook, Excel, PowerPoint, Word
  - No barrier to working abroad for a short time in South Korea or the other company World Wide sites
  - Intermediate or higher level of utilization ability for AutoCAD
  
  {PREFER}
  • Work experience in Semiconductor package product development with customers
  • Work experience in assembly process for System in Package (SiP)
  • Knowledge and skills on statistical data analysis and design of experiments (JMP)
  • Intermediate or higher level of skill of development project management

• 英文

  Intermediate Level

• 其他语言

  None